Stacked bit line dual word line nonvolatile memory

ABSTRACT

An arrangement of nonvolatile memory devices, having at least one memory device level stacked level by level above a semiconductor substrate, each memory level comprising an oxide layer substantially disposed above a semiconductor substrate, a plurality of word lines substantially disposed above the oxide layer; a plurality of bit lines substantially disposed above the oxide layer; a plurality of via plugs substantially in electrical contact with the word lines and, an anti-fuse dielectric material substantially disposed on side walls beside the bit lines and substantially in contact with the plurality of bit lines side wall anti-fuse dielectrics.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of co-pending U.S. patent applicationSer. No. 13/163,363 filed on 17 Jun. 2011, which application is acontinuation of U.S. patent application Ser. No. 12/475,839 filed on 1Jun. 2009, now U.S. Pat. No. 7,985,989, which application is acontinuation of U.S. patent application Ser. No. 12/184,181 filed on 31Jul. 2008, now U.S. Pat. No. 7,700,415, which application is adivisional of U.S. patent application Ser. No. 11/217,659, filed on 31Aug. 2005, now U.S. Pat. No. 7,420,242.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to nonvolatile memory devices and, moreparticularly, to arrangements of nonvolatile memory devices with eachmemory level stacked level by level above a semiconductor substrate.

2. Description of Related Art

A nonvolatile semiconductor memory device is typically designed tosecurely hold data even when power is lost or removed from the memorydevice. Several types of nonvolatile memory devices have been proposedin the related art, examples of which include U.S. Pat. No. 4,489,478(the '478 patent) to Sakurai, U.S. Pat. No. 5,441,907 (the '907 patent)to Sung et al., U.S. Pat. No. 5,536,968 to Crafts et al. (the '968patent), U.S. Pat. No. 5,565,703 to Chang (the '703 patent), U.S. Pat.No. 5,835,396 (the '396 patent) to Zhang, and U.S. Pat. No. 6,034,882(the '882 patent) to Johnson et al.

The nonvolatile memory devices taught by the '907 and '968 patentsappear to suffer from a disadvantage wherein the number of nonvolatiledevices per unit area of semiconductor substrate is limited by theirarrangement in a two-dimensional structure. The device taught by the'907 patent does not appear to be electrically programmable.Furthermore, the polysilicon fuse array structure disclosed in the '968patent has the disadvantage that the fuse arrays appear to requirerelatively large separations between adjacent elements, and the verticalanti-fuse structures described in the '703, 396 and '882 patents appearto require substantial areas of the semiconductor floor plan.

Needs thus exist in the related art for nonvolatile memory devices thatcan be implemented with an increased number of nonvolatile memorydevices per unit area of semiconductor substrate, that are electricallyprogrammable at sufficiently high programming rates and that occupy areduced area of semiconductor floor plan.

SUMMARY OF THE INVENTION

The present invention addresses these needs by providing, in accordancewith one aspect, nonvolatile memory devices and methods for making thesame that can be implemented to provide increased numbers of nonvolatilememory cell devices per unit area of semiconductor substrate. Anarrangement of the nonvolatile memory devices of the present inventioncan have a plurality of memory levels stacked level by level above asemiconductor substrate, programmable on both positive and negativeswings of a programming current pulse cycle, having a reducedrequirement for semiconductor floor plan, and being able to store atleast one data bit per cell.

The invention disclosed may comprise an arrangement of nonvolatilememory devices having a plurality of memory levels stacked level bylevel above a semiconductor substrate, wherein each memory levelcomprises a semiconductor substrate, an oxide layer disposedsubstantially above the semiconductor substrate, pairs of word linesdisposed substantially above the semiconductor substrate, a plurality ofbit lines disposed substantially above the semiconductor substrate, ananti-fuse dielectric material disposed on side walls substantiallybeside the bit lines and substantially in contact with the bit lines anda plurality of via plugs substantially in electrical contact with theword lines. The present invention may include word lines arranged,according to one embodiment, singly, or, according to anotherembodiment, in pairs.

In the presently preferred embodiment, a nonvolatile memory device isfabricated by providing a semiconductor substrate, forming an oxidelayer disposed substantially above the semiconductor substrate, forminga pair of word lines disposed substantially above the oxide layer,forming a plurality of bit lines disposed substantially above the oxidelayer, forming an anti-fuse dielectric material substantially disposedbeside the plurality of bit lines and substantially in contact with theplurality of bit lines, etching a plurality of via between the pluralityof word lines and the plurality of bit lines and, forming a plurality ofvia plugs substantially in electrical contact with the plurality of wordlines.

According to one aspect of the present invention, an arrangement ofnonvolatile memory devices, having at least one memory device levelstacked level by level above a semiconductor substrate, is provided.Each memory level comprises an oxide layer substantially disposed abovea semiconductor substrate, a pair of word lines substantially disposedabove the oxide layer, a plurality of bit lines substantially disposedabove the oxide layer, a plurality of via plugs substantially inelectrical contact with the word lines, and anti-fuse dielectricmaterials substantially disposed on side walls beside the bit lines andsubstantially in contact with the anti-fuse dielectric materials.

Any feature or combination of features described herein are includedwithin the scope of the present invention, provided that the featuresincluded in any such combination are not mutually inconsistent as willbe apparent from the context, this specification, and the knowledge ofone of ordinary skill in the art. Additional advantages and aspects ofthe present invention are apparent in the following detailed descriptionand claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a nonvolatile memory device inaccordance with an illustrative embodiment of the present invention;

FIG. 2 is a pictorial diagram illustrating, in a frontal view, anexemplary interconnection of a stack of bit lines, anti-fuse dielectricmaterial, a via plug, and a word line according to the presentinvention;

FIG. 3 a is a pictorial diagram showing detail of a memory cell formedby an interconnection of the via plug, anti-fuse dielectric material,and a bit line shown in FIG. 2;

FIG. 3 b is a pictorial diagram of a configuration of the memory cell ofFIG. 3 a programmed to a logic ‘1’ program state;

FIG. 4 is a pictorial diagram showing detail of a breakdown region inthe memory cell of FIG. 3 b;

FIG. 5 is a simplified diagram illustrating a top view of placement offirst word lines according to an embodiment of the present invention;

FIG. 6 is a top view of second word lines formed above the first wordlines illustrated in FIG. 5;

FIG. 7 is a top view illustrating a position of bit lines added to thestructure shown in FIG. 6;

FIG. 8 is a pictorial top plan view of the nonvolatile memory deviceshown in FIG. 1 in accordance with an illustrated embodiment of thepresent invention;

FIG. 9 is a pictorial cross-sectional view of the nonvolatile memorydevice of the embodiment illustrated in FIG. 8, taken along a line 9-9′of FIG. 8 in accordance with the present invention; FIG. 9A is a detailof a portion of FIG. 9.

FIG. 10 is a schematic diagram of an embodiment of a stacked bit linedual word line nonvolatile memory device including circuitry capable ofaddressing memory elements in the device;

FIG. 11 is a flow diagram depicting an implementation of a method ofdetermining a program state of a memory cell according to the presentinvention;

FIG. 12 is a flow diagram describing an implementation of a method offabricating an arrangement of nonvolatile memory devices in accordancewith the present invention;

FIGS. 13-18 are cross-sectional diagrams illustrating results ofapplying steps of the method illustrated in FIG. 12;

FIG. 19 is a plan view of an embodiment of a mask that defines a patternof a self-aligned etch step in the method of FIG. 12;

FIGS. 20-23 are cross-sectional diagrams illustrating further results ofapplying steps of the method of FIGS. 12; and

FIG. 24 is a flow diagram illustrating steps of an implementation of amethod of programming memory cells in a stacked bit line dual word linenonvolatile memory device according to the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Reference will now be made in detail to the presently preferredembodiments of the invention, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same or similar referencenumbers are used in the drawings and the description to refer to thesame or like parts. It should be noted that the drawings are in greatlysimplified form and are not to precise scale. In reference to thedisclosure herein, for purposes of convenience and clarity only,directional terms, such as, top, bottom, left, right, up, down, above,below, beneath, rear and front, are used with respect to theaccompanying drawings. Such directional terms should not be construed tolimit the scope of the invention in any manner.

Although the disclosure herein refers to certain illustratedembodiments, it is to be understood that these embodiments are presentedby way of example and not by way of limitation. The intent of thefollowing detailed description, although discussing exemplaryembodiments, is to be construed to cover all modifications, alternativesand equivalents as may fall within the spirit and scope of the inventionas defined by the appended claims. For example, it is understood by aperson of ordinary skill in the art that the anti-fuse dielectricmaterials of the present invention may be formed of insulating materialssuch as silicon dioxide (SiO₂), silicon nitride (SiN), aluminum oxide(Al₂0₃), hafnium oxide (Hf0₂), or the like.

It is to be understood and appreciated that the process steps andstructures described herein do not cover a complete process flow for themanufacture of nonvolatile memory devices. The present invention may bepracticed in conjunction with various integrated circuit fabrication andoperation techniques that are conventionally used in the art, and onlyso much of the commonly practiced process steps are included herein asnecessary to provide an understanding of the present invention.

Referring more particularly to the drawings, FIG. 1 shows a perspectiveview of a portion of a nonvolatile memory device 5 having a plurality oforthogonally arranged word lines 10 and bit lines 20. The nonvolatilememory device is substantially disposed above an oxide layer (notshown), which is substantially disposed above a semiconductor substrate(also not shown). The word lines 10 of the nonvolatile memory device 5comprise first word lines 10 a substantially disposed on a firsthorizontal plane relative to the oxide layer and second word lines 10 bsubstantially disposed on a second horizontal plane relative to theoxide layer. The plurality of bit lines 20 may be disposed on aplurality of horizontal planes relative to the oxide layer. For example,as presently embodied, two layers of bit lines 20 of the nonvolatilememory device 5 are illustrated comprising first bit lines 20 asubstantially disposed on a third horizontal plane relative to the oxidelayer and second bit lines 20 b substantially disposed on a fourthhorizontal plane relative to the oxide layer. Bit lines arranged layerby layer as described may be said to form a “stack” of bit lines.

In the illustrated embodiment, the word lines 10 are formed before thebit lines 20, wherein for example the first word lines 10 a are formedbefore the second word lines 10 b and wherein the first bit lines 20 aare formed before the second bit lines 20 b. The first word lines 10 aand second word lines 10 b may be arranged into sets such as pairs ofdual word lines, wherein, for example, a bit line may connect (through avia plug) to first and second word line of a dual word line pair.Additionally, an individual word line may connect to a plurality of bitlines. In accordance with one aspect of the present invention, anonvolatile memory device according to the present invention maycomprise a plurality of first nonvolatile memory cells 5 a substantiallydisposed above an oxide layer substantially disposed above asemiconductor substrate and having a plurality of orthogonally arrangedword lines 10 and bit lines 20 a and a plurality of second nonvolatilememory cells 5 b substantially disposed above the oxide layersubstantially disposed above the semiconductor substrate and having aplurality of orthogonally arranged word lines 10 and bit lines 20 b. Theplurality of first nonvolatile memory cells 5 a may comprise a firstnonvolatile memory device, and the plurality of second nonvolatilememory cells 5 b may comprise a second nonvolatile memory device. Firstnonvolatile memory cells 5 a may similarly be associated, for example,with first bit lines 20 a; second nonvolatile memory cells 5 b maylikewise be associated with second bit lines 20 b. Both first and secondnonvolatile memory cells 5 a and 5 b connect in the illustratedembodiment to first word lines 10 a and second word lines 10 b throughrespective first and second via plugs 40 a and 40 b. The first andsecond via plugs 40 a and 40 b have disposed on sidewalls thereofanti-fuse dielectric material 30 a, 31 a, 30 b, and 31 b.

The word lines 10 of the plurality of first memory cells 5 a comprisefirst word lines 10 a substantially disposed on a first horizontal planerelative to the oxide layer and second word lines 10 b substantiallydisposed on a second horizontal plane relative to the oxide layer.Moreover, as presently embodied, the bit lines of the plurality of firstmemory cells 5 a comprise first bit lines 20 a substantially disposed ona third horizontal plane relative to the oxide layer.

The word lines 10 of the plurality of second memory cells 5 b comprisefirst word lines 10 a substantially disposed on a first horizontal planerelative to the oxide layer and second word lines 10 b substantiallydisposed on a second horizontal plane relative to the oxide layer.Moreover, as presently embodied, the bit lines of the plurality ofsecond memory cells 5 b comprise second bit lines 20 b substantiallydisposed on a fourth horizontal plane relative to the oxide layer.Additional levels of nonvolatile memory cells may be provided inmodified embodiments by providing additional bit lines substantiallydisposed on additional horizontal planes relative to the oxide layer.

A first anti-fuse dielectric material 30 a and 31 a formed of, e.g.,silicon dioxide (SiO₂) may be substantially disposed on side wallsbeside first via plug 40 a, which is substantially disposed between bitlines 20 and a first word line 10 a. Similarly, a second anti-fusedielectric material 30 b and 31 b may be substantially disposed on sidewalls beside second via plug 40 b disposed between bit lines 20 and asecond word line 10 b. In a preferred embodiment, the first anti-fusedielectric material 30 a and 31 a and the second anti-fuse dielectricmaterial 30 b and 31 b have substantially the same dimensions and aremade of substantially the same material.

Via etched between the word lines 10 and the bit lines 20 formed frompolysilicon having a first type of background impurity are substantiallyfilled by first and second via plugs (represented in FIG. 1 by first viaplug 40 a and second via plug 40 b) formed from polysilicon doped with abackground impurity of a second type opposite to the first type. Forexample, the bit lines 20 may be formed from polysilicon having anN-type background impurity type, and the first and second via plugs andmay be formed from polysilicon having a P-type background impurity type.

Each bit line of the first bit lines 20 a and the second bit lines 20 bis coupled between one of the first word lines 10 a and one of thesecond word lines 10 b. More particularly, each of the first bit lines20 a is coupled to one of the first word lines 10 a by means of one ofthe first anti-fuse dielectric materials 30 a and 31 a and one of thefirst via plugs, e.g., first via plug 40 a. Each of the first bit lines20 a is further coupled to one of the second word lines 10 b by means ofone of the second anti-fuse dielectric materials 30 b and 31 b and oneof the second via plugs, e.g., second via plug 40 b. Moreover, each ofthe second bit lines 20 b is coupled to one of the first word lines 10 aby means of one of the first anti-fuse dielectric materials 30 a and 31a and one of the first via plugs, e.g., first via plug 40 a, and iscoupled to one of the second word lines 10 b by means of one of thesecond anti-fuse dielectric materials 30 b and 31 b and one of thesecond via plugs, e.g., second via plug 40 b. The first via plugs 40 aare substantially disposed above and are substantially in electricalcontact with the first word lines 10 a. The second via plugs aresubstantially disposed above and are substantially in electrical contactwith the second word lines 10 b.

FIG. 1 further illustrates an exemplary spatial relationship betweenfirst word lines 10 a and second word lines 10 b. Second word line 10 bin the illustrated embodiment comprises a “shelf” portion 15 b thatextends over first word line 10 a. The relative position of the shelfportion 15 b and first word line 10 a is depicted graphically in FIG. 1by a “shadow” 16 b of the shelf portion 15 b on the first word line 10a. The shadow 16 b, which is shown only for purposes of clarifying aportion of the geometry of the nonvolatile memory device 5, demonstratesthat, e.g., first via plug 40 a and second via plug 40 b may be disposedin substantial linear alignment along a length dimension of one of theplurality of first word lines 10 a.

FIG. 2 is a pictorial diagram illustrating, in a frontal view, anexemplary interconnection of a stack of bit lines 20 a and 20 b,anti-fuse dielectric material 30 a, a first via plug 40 a, and a firstword line 10 a configured according to the present invention. The firstword line 10 a in the diagram connects to a first bit line 20 a througha first via plug 40 a and anti-fuse dielectric material 30 a. Similarly,first word line 10 a connects to a second bit line 20 b through thefirst via plug 40 a and anti-fuse dielectric material 30 a. Detail ofthe interconnection of, e.g., first bit line 20 a, anti-fuse dielectricmaterial 30 a, and first via plug 40 a associated with an exemplarymemory cell is shown in FIG. 3 a. Anti-fuse dielectric material 30 a isshown disposed substantially beside first bit line 20 a and betweenfirst bit line 20 a and first via plug 40 a. Accordingly, substantiallyno electrical current can pass between first bit line 20 a and first viaplug 40 a as long as anti-fuse dielectric material 30 a remains intact.The intact form of anti-fuse dielectric material 30 a may represent adefault configuration for an exemplary memory cell, the defaultconfiguration corresponding, for example, to a logic ‘0’ program statefor the memory cell. It should be understood that additional bit lines(not shown) may connect to the first via plug 40 a illustrated in FIG.2. The additional bit lines may contact the first via plug 40 a throughadditional first anti-fuse dielectric material 31 a (FIG. 1) that mayform additional memory cells. This concept is explained more fully indiscussion below related to FIGS. 9 and 9 a.

FIG. 3 b illustrates one modified configuration of the exemplary memorycell, the modified configuration corresponding to a logic ‘1’ programstate for the exemplary memory cell. The diagram shows a region 25 acomprising a breakdown of the anti-fuse dielectric material 30 a, acondition that may be induced, for example, by applying a relativelyhigh voltage (i.e., a voltage higher than the breakdown voltage of theanti-fuse dielectric material 30 a) between word line 10 a (FIG. 2) andbit line 20 a. FIG. 4 shows detail of the breakdown region 25 a for anexample wherein the bit line 20 a is formed of N-type material and thevia plug 40 a is formed of P-type material. In that instance, a PN diodeforms that exhibits, for example, a depletion region 45 at a boundarybetween the P and N areas. Such a PN diode may be capable of allowingcurrent in a P-to-N direction while not supporting current in an N-to-Pdirection. A cell having intact anti-fuse dielectric material 30 a (FIG.3 a), on the other hand, supports current in neither direction.Detection of the programmed state (i.e. ‘0’ or ‘1’) of a memory cell canbe accomplished by applying an external voltage to a bit line and a wordline associated (through a via plug) with a given memory cell andsensing a current magnitude. For example, if a voltage greater than athreshold voltage of the PN diode (e.g., greater than about 0.7 volts)is applied to a word line that is positive with respect to a chosen bitline, then a substantially zero value of sensed current indicates that acorresponding memory cell is programmed to a logic ‘0’ state. If acurrent that exceeds a given threshold is sensed, then it may bedetermined that the memory cell is programmed to a logic ‘1’ state. Bitline (e.g., N-type) material 20 a in FIG. 4 “punches through” theanti-fuse dielectric material 30 a causing breakdown of the anti-fusedielectric material 30 a. In another embodiment (not illustrated), viaplug (e.g., P-type) material 40 a may punch through the anti-fusedielectric material 30 a. Either phenomenon can form a PN diodeconsistent with programming the memory cell to a logic ‘1’ state asdescribed herein.

FIG. 5 is a simplified diagram illustrating a top view of placement offirst word lines according to an embodiment of the present invention.First word lines 10 a may be formed, for example, on an oxide layer thatoverlies a semiconductor substrate. Interposition of second word lines10 b with first word lines 10 a is illustrated by a diagram in FIG. 6.Typically, second word lines 10 b are disposed on an oxide layer formedabove the first word lines 10 a. In the illustrated embodiment, portionsof the second word lines 10 b are formed as shelves 15 b (cf. FIG. 1)that are disposed substantially above the first word lines 10 a. Aresult of adding bit lines 20 (FIG. 1) to the structure illustrated inFIG. 6 is shown in a top isometric view in FIG. 7. Bit lines 20 b areshown in FIG. 7 that may, in a typical embodiment, be disposed above bitlines 20 a (not shown) as well as above word lines 10 a and 10 b.Insulating material such as SiO₂ (not shown) may separate respectivelayers comprising, e.g. word lines 10 a, word lines 10 b, bit lines 20a, and bit lines 20 b.

Via plugs may be used to connect bit lines to word lines as illustratedin FIG. 1 and as further illustrated in a top view in FIG. 8. Thestructure in FIG. 8 represents the embodiment shown in FIG. 7 to whichhas been added a plurality of first via plugs 40 a beside which isdisposed a plurality of anti-fuse dielectric materials 30 a and 31 athat connect bit lines 20 (FIG. 1) to first word lines 10 a. Similarly,a plurality of second via plugs 40 b having a plurality of anti-fusedielectric materials 30 b and 31 b disposed beside via plugs 40 bconnect bit lines 20 to second word lines 10 b.

FIG. 9 is a cross-sectional view of the stacked bit line dual word linenonvolatile memory device illustrated in FIG. 8. The cross-section istaken along a line 9-9′ of FIG. 8. The embodiment illustrated in FIG. 9shows a first word line 10 a, shelves 15 b of second word lines 10 b(not visible), first bit lines 20 a, second bit lines 20 b, first viaplugs 40 a, and second via plugs 40 b. One of the first via plugs 40 ain FIG. 9, for example, connects first word line 10 a to one of thefirst bit lines 20 a and to one of the second bit lines 20 b through oneof the anti-fuse dielectric materials 30 a. The same first via plug 40 aconnects first word line 10 a to another of the first bit lines 20 a andto another of the second bit lines 20 b through one of the anti-fusedielectric materials 31 a. One of the second via plugs 40 b, on theother hand, connects second word line 10 b (through shelf 15 b) to oneof the first bit lines 20 a and to one of the second bit lines 20 bthrough one of the anti-fuse dielectric materials 30 b. Similarly, thesame second via plug 40 b connects second word line 10 b (through shelf15 b) to another of the first bit lines 20 a and to another of thesecond bit lines 20 b through one of the anti-fuse dielectric materials31 b.

As described above with reference to FIGS. 2-4, the structure of FIG. 9comprises a plurality of memory cells, for example, memory cells 50 a,51 a, 50 b, and 51 b, that may be assume a program state according to acondition of portions of anti-fuse dielectric material disposed betweenvia plugs and bit lines. For example, memory cell 50 a, comprisinganti-fuse dielectric material 31 b disposed between a second via plug 40b and a first bit line 20 a is intact in the illustrated embodiment. Asdescribed above, intact anti-fuse dielectric material may correspond toa logic ‘0’ program state. Memory cell 51 b, comprising anti-fusedielectric material 31 a disposed between a first via plug 40 a and asecond bit line 20 b, is broken down (represented by a dark rectangle)in the illustrated embodiment. Broken-down anti-fuse dielectric materialmay correspond to a logic ‘1’ program state as is further describedabove with reference to FIGS. 2-4. Similarly, memory cell 51 a maycorrespond to a logic ‘1’ program state, and memory cell 50 b maycorrespond to a logic ‘0’ program state.

FIG. 9 a is a detailed cross-sectional view of a portion of thenonvolatile memory device illustrated in FIG. 9. Six individual bitlines are identified in FIG. 9 a, three of which (20 a 1, 20 a 2, and 20a 3) are first bit lines 20 a (FIG. 9) and three of which (20 b 1, 20 b2, and 20 b 3) are second bit lines 20 b. A first via plug 40 a in FIG.9 a connects bit lines 20 a 1 and 20 b 1 to first word lines 10 athrough anti-fuse dielectric material 30 a. First via plug 40 a furtherconnects bit lines 20 a 2 and 20 b 2 to first word line 10 a throughanti-fuse dielectric material 31 a. Second via plug 40 b connects bitlines 20 a 2 and 20 b 2 to second word line 10 b (invisible) throughshelf portion 15 b through anti-fuse dielectric material 30 b. Bit lines20 a 3 and 20 b 3 are connected to first word line 10 b by via plug 40 bthrough anti-fuse dielectric material 31 b;. A total of eight memorycells are depicted in FIG. 9 a, the memory cells corresponding toregions of anti-fuse dielectric material that are disposed between a viaplug and a bit line. Memory cells programmed to a logic ‘1’ state asdescribed herein are illustrated as dark rectangles. Memory cells thatare not programmed (i.e., are programmed to a logic ‘0’ state) areillustrated as white rectangles with a dotted border. For example, thememory cell disposed between bit line 20 a 1 and via plug 40 a isprogrammed to a logic ‘1’ as is the memory cell disposed between viaplug 40 a and bit line 20 b 2. Conversely, the memory cell disposedbetween via plug 40 b and bit line 20 b 2, the memory cell disposedbetween via plug 40 b and bit line 20 a 3, and the memory cell disposedbetween via plug 40 a and bit line 20 b 1 are programmed to a logic ‘0’.

FIG. 10 is a schematic diagram of an embodiment of a stacked bit linedual word line nonvolatile memory device including circuitry that may beemployed to address memory elements in the device. For purposes ofillustration, bit lines in the diagram are denoted by Bx0, Bx1, . . . ,Bx4 where ‘x’ denotes a layer of a bit line. That is, bit lines on afirst layer (e.g., bit lines 20 a in FIGS. 1 and 9) may be denoted byB10, B11, . . . , B14; bit lines on a second layer (e.g., bit lines 20 bin FIGS. 1 and 9) may be denoted by B20, B21, . . . , B24, and so on forlayers more than two. Word lines in the diagram are similarlyidentified, with first word lines being denoted by W10, W11, . . . ,W15, and second word lines being denoted by W20, W21, and W22. Addressedmemory elements may be programmed, or their program state determinedusing circuitry similar to that illustrated in FIG. 10. Correspondencesamong reference numbers in FIGS. 8, 9, and 10 should be noted in thefollowing description.

The embodiment illustrated in FIG. 10 includes a bit line decoder andsense amplifiers 55 that connect to bit lines through a layer selectiondecoder 65. The layer selection decoder 65 may select from one of aplurality of layers of bit lines. For example, using two selection lines60, the layer selection decoder 65 may select between two layers of bitlines 20 a and 20 b as illustrated, for example, in FIGS. 1 and 9. Forembodiments having more than two, i.e. three or more, layers of bitlines, additional selection lines may be employed in addition to the twoselection lines 60 shown in the diagram. The layer selection decoder 65operates by selecting a layer ‘x’ of bit lines and by providing anelectrical connection between the selected layer ‘x’ of bit lines andthe bit line decoder and sense amplifiers 55. Accordingly, bit lines asobserved by the bit line decoder and sense amplifiers 55 are denoted asB0, B1, . . . , B4 in the diagram, it being understood that layerselection is transparent to the bit line decoder and sense amplifiers55. Word lines may be accessed by a first word line decoder and wordline drive 70 and by a second word line decoder and word line drive 75.First word line decoder and word line drive 70 is electrically connectedto and is capable of accessing first word lines W10, W11, . . . , W15(denoted as 10 a in FIGS. 1 and 6, for example). Second word linedecoder and word line drive 75 is electrically connected to and iscapable of accessing second word lines W20, W21, and W22 (denoted as 10b in FIGS. 1 and 6).

Bit lines in the embodiment shown in the diagram are fabricated ofN-type material; via plugs are fabricated of P-type material. Consider,for example, the via plug 80 a in the diagram. Comparison with FIGS. 6-8confirms that via plug 80 a is a first via plug (e.g., first via plug 40a in FIG. 1) that is disposed on a first word line 10 a, specifically,first word line W10 in the diagram. Via plug 80 a has disposed on bothsides thereof, anti-fuse dielectric material 30 a and 31 a that makescontact with respective sets of bit lines Bx0 and Bx1. For example, withtwo layers of bit lines, via plug 80 a connects through anti-fusedielectric material 30 a and 31 a to bit lines B10 and B11 on the firstlevel and to bit lines B20 and B21 on the second level. Each of thecontacts may be in a broken-down or an intact state according to aprogrammed state for a memory cell associated with each contact.

A program state, i.e., logic ‘0’ or logic ‘1’ as described above, of amemory cell in the illustrated memory device can be determined ingeneral, according to an implementation of a method of the presentinvention as illustrated in a flow diagram in FIG. 11. The illustratedimplementation comprises choosing a memory cell at step 100. Each memorycell has connected thereto a unique bit line, which is selected at step105. The selected bit line should be grounded through a sense amplifier.Referring, for example, to FIG. 9, memory cell 51 b may be selected. Achosen memory cell further has connected thereto a unique via plug thatconnects, in turn, to a unique word line, which is selected at step 110.For example, word line 10 a is selected in FIG. 9 as the word line thatis connected to memory cell 51 b (through a via plug 40 a). A negativeread voltage is then applied to the selected word line at step 115, anda current is sensed in the selected bit line 120, which should beconnected to ground through a low-impedance path. Typical values for aread voltage may range from about 1 volts to about 2 volts, about 1.5volts in a preferred embodiment. A test of current magnitude isperformed at step 125 by comparing the magnitude of the sensed currentwith a current threshold. If the magnitude of the sensed current exceedsthe current threshold, then it may be inferred that the anti-fusedielectric material in the memory cell has broken down, and the programstate of the memory cell is decided to be logic ‘1’ at step 130. If themagnitude of the sensed current does not exceed the current threshold,then the program state of the memory cell may be decided to be a logic‘0’, assuming that the anti-fuse dielectric material in the memory cellis intact.

According to another implementation of the method (not illustrated), aplurality of memory cells in a chosen level may be read simultaneously.In that instance, a level of memory cells may be chosen at step 100using, e.g., selection lines 60 as illustrated in FIG. 10. A pluralityof bit lines adjacent to the memory cells is then grounded through senseamplifiers (e.g. bit line decoder and sense amplifiers 55 in FIG. 10) atstep 105. Remaining steps of this implementation of the method mayfollow the steps illustrated in FIG. 11.

A method of the present invention for fabricating an arrangement ofnonvolatile memory devices is illustrated, according to an exemplaryimplementation in a flow diagram in FIG. 12. FIGS. 13-22 illustrateresults of applying steps of the method. The implementation of themethod may comprise providing a semiconductor substrate 400 (FIG. 13) atstep 200. An insulating layer 405, which may comprise SiO₂, may beformed substantially above the semiconductor substrate 400 at step 205,after which a layer of first word line material 410 may be deposited atstep 210. The layer of first word line material 410, which may beformed, for example, of tungsten (W), tantalum (Ta), platinum (Pt),polycide plus polysilicon, or the like may be deposited to a thicknessranging from about 200 nm to about 400 nm, preferably about 250 nm. Thelayer of first word line material 410 may be patterned at step 215 tocreate a substantially parallel plurality of first word lines 10 asubstantially disposed above the insulating layer 405 as illustrated,for example, in FIG. 5. Spaces between the first word lines 10 a maythen be filled in with high density plasma (HDP) oxide at step 220 afterwhich a chemical mechanical polishing (CMP) step is performed, stoppingwhen the layer of first word lines 10 a is reached. Another layer ofinsulating material 415, e.g., SiO₂, may then be deposited at step 230to a thickness ranging from about 100 nm to about 200 nm, preferablyabout 150 nm. A reference line 416 is shown in FIGS. 13-15 illustratingan example of an upper limit of the layer 415 of insulating material. Asecond layer of word line material may be deposited at step 235. to athickness of between about 200 nm and about 400 nm, preferably about 250nm. The second layer of word line material may be patterned at step 240to form second word lines 10 b according to a layout illustrated, forexample, in FIG. 6. As embodied in FIG. 6, second word lines 10 bcomprise shelf portions 15 b that may be disposed above first word lines10 a as already described. An exemplary result of performing step 240 ofthe method is shown in FIG. 14, which is a cross-sectional view takenalong a line 14-14′ in FIG. 6 after performing a fill-in of additionalinsulating material 420, e.g., SiO₂, at step 245. One implementation ofthe method performs CMP after step 245, stopping on the layer of secondword lines 10 b, which layer is also occupied by the shelf portions 15 billustrated in FIG. 14. A reference line 421 in FIGS. 14 and 15 isincluded to illustrate an example of a position of an upper surface ofthe layer of second word lines 10 b (including shelf portions 15 b).

Another layer of insulating material 425 (FIG. 15), e.g., SiO₂, is thendeposited on the layer of second word lines 10 b (not visible in FIG.15) at step 250 to a thickness of between about 60 nm and about 100 nm,preferably about 80 nm. A first layer of bit line material 430, whichmay comprise, for example, N-type polysilicon, is then deposited at step255. The first layer of bit line material 430 may be patterned at step260 to form a first plurality of bit lines 20 a substantially disposedabove the layer of insulating material 425 and extending longitudinallyinto the plane of the diagram in FIG. 16. The patterning may provide fora nominally uniform spacing 22 between adjacent bit lines. Afterperforming a fill-in step with, e.g., HDP oxide at step 265, CMPperformed at step 270 may be used to form a flat upper surface of thefirst plurality of bit lines 20 a.

Steps 250-270 of the method may be repeated according to a chosen numberof layers of bit lines as represented by step 275 of the implementationof the method illustrated in FIG. 12. For example, as illustrated in theembodiment of FIG. 16, another layer of insulating material, e.g., SiO₂,may be deposited at step 250, and a second layer of bit line material440 may be deposited at step 255. The second layer of bit line material440 may be patterned at step 260, HDP oxide may be used in a fill-instep 265, and CMP may be performed at step 270. These steps may yield aresult as illustrated in FIG. 17 showing two layers of bit lines 20 aand 20 b separated by a layer 435 of insulating material. Althoughinsulating material such as oxide is not explicitly shown in FIG. 17, itshould be understood that white areas of the diagram typically arefilled with insulating material as already described.

A self-aligned deep etch may be performed at step 280 to form aplurality of via. The deep etch, which may employ an etchant having ahigher selectivity for oxide than for polysilicon or metal, may removeoxide in order to form substantially vertical via. The via may extendfrom first word lines 10 a and from shelf portions 15 b of second wordlines 10 b beside and between first and second bit lines 20 a and 20 bas illustrated in FIG. 18. In particular, first via 450 may extend fromfirst word lines 10 a, and second via 455 may extend from shelf portions15 b of second word lines 10 b. A mask 460 comprising open areas 465that may define the pattern of the etch is illustrated in FIG. 19.Photolithographic techniques well known in the art may cause etching tooccur in open areas not occupied by polysilicon or metal according to aplacement of the mask 460 on an upper surface of the structure shown inFIG. 18. The mask 460 may be oriented with length dimensions of theplurality of open areas 465 oriented parallel to first and second wordlines 10 a and 10 b and orthogonal to the layers of bit lines (e.g. bitlines 20 a and 20 b in FIG. 17). Horizontal extents of the via 450 and455 are therefore determined in a first direction nominally parallel tothe bit lines by a width dimension 23 of the plurality of open areas 465and in a second direction substantially orthogonal to the bit lines bythe spacing 22 (FIGS. 16-18).

A sidewell oxide 470, e.g., SiO₂, may be deposited on sidewalls andbottom surfaces of the via 450 and 455 at step 285 as illustrated inFIG. 20. The oxide may be deposited to a thickness of about 1 nm toabout 5 nm, nominally 2 nm. A non-isotropic etch then may be performedat step 290 with the etch directed in a substantially vertical directionto remove oxide at bottoms of the via 450 and 455. The non-isotropicetch thereby creates first oxide openings 475 that expose first wordlines 10 a as illustrated in FIG. 21. The etch further creates secondoxide openings 480 that expose shelf portions 15 b of second word lines10 b.

Contacts with first word lines 10 a and second word lines 10 b (throughshelf portions 15 b) then may be formed by depositing material to formrespective first and second via plugs 40 a and 40 b at step 295 asdepicted in FIG. 22. It should be noted that first and second via plugs40 a and 40 b, which, in a typical embodiment, may formed of P-typepolysilicon, have formed on sidewalls thereof, oxide strips that mayconstitute anti-fuse dielectric material 30 a, 31 a, 30 b, and 31 b thatalso is disposed beside bit lines 20 a and 20 b. The structure depictedin cross-section in FIG. 22 should be compared with the perspective viewof the memory device illustrated in FIG. 1. Bit lines may be connectedto, for example, a metal layer on a surface of the structure at step 300of the implementation of the method depicted in FIG. 12.

One technique for providing connection of the bit lines is illustratedin FIG. 23, which is a cross-sectional view of the device shown in FIG.22 taken along a line 23-23′. In the diagram, a first bit line 20 a,which may represent a plurality of first bit lines 20 a, is fabricatedwith a somewhat longer length than the length of a second bit line 20 b,likewise representing a plurality of second bit lines 20 b. Thedifference in lengths of the first bit line 20 a and the second bit line20 b permits respective first and second via plugs 485 a and 485 b to beformed. First and second via plugs 485 a and 485 b may connectrespective first and second bit lines 20 a and 20 b to connections in ametal layer 490, for example. In a typical embodiment, first and secondvia plugs 485 a and 485 b are formed of one of N+ polysilicon, tungsten,or other conducting material. A third bit line 20 c, which may representa third plurality of bit lines 20 c and an associated third via plug 485c are shown in phantom in FIG. 23, emphasizing that, although theexamples disclosed herein, generally, comprise two layers of bit lines,the invention contemplates memory devices comprising three or morelayers of bit lines.

A method of operation of the present invention may include programmingmemory cells in the stacked bit line dual word line nonvolatile memorydevice. One implementation of a programming method may be illustrated bya flow diagram shown in FIG. 24. This implementation of the methodcomprises receiving a program state (i.e. logic ‘0’ or logic ‘1’) atstep 305. A memory cell to be programmed is chosen at step 310. As anillustrative example, memory cell 51 b (FIG. 9) may be chosen at step310. At step 315 a bit line connected (through anti-fuse dielectricmaterial) to the chosen memory cell is selected. Referring to FIG. 9, itshould be clear that only one of the second bit lines 20 b lies adjacentto and is connected at step 315 (through anti-fuse dielectric material)to the selected memory cell. A word line connected (through a via plug)to the chosen memory cell is selected at step 320. Referring again toFIG. 9, word line 10 a, which connects to memory cell 51 b, is selectedat step 320. According to a value of the program state received at step305, a test is performed at step 325. If the received program state islogic ‘1’, then the selected bit line is grounded at step 330. Allunselected word lines are allowed to float, and, if the received programstate is determined at step 325 to be logic ‘0’, then the selected bitline also is allowed to float. A programming voltage (e.g., clockpulses) is applied directly to the selected word line. In general,values are programmed into selected memory cells by blowing theanti-fuse dielectric material for logical l's but not logical 0's onpositive swings, negative swings or both positive and negative swings ofthe programming voltage pulse cycles. While the implementation of theprogramming method described in FIG. 24 applies to the programming of asingle memory cell, it should be appreciated that all memory cellsconnected to a chosen word line may be programmed simultaneouslyaccording to a straightforward modification of the implementation asdescribed.

As an alternative example, in another embodiment of the presentinvention, a first cell 51 b (FIG. 9) may be programmed by grounding thefirst word line 10 a to which it is coupled at 0V reference voltage andapplying about 5V to 15V programming voltage to the second bit line 20 bto which it is coupled, with other bit and word lines allowed to assumea floating voltage. A second cell 50 b may be programmed by groundingthe second word line 10 b (invisible in FIG. 9) to which it is coupledat 0V reference voltage and applying about +5V to 15V programmingvoltage to the second bit line 20 b to which it is coupled with otherbit and word lines allowed to assume a floating voltage.

In view of the foregoing, it will be understood by those skilled in theart that the methods of the present invention can facilitate formationand code programming of nonvolatile memory devices in an integratedcircuit. The above-described embodiments have been provided by way ofexample, and the present invention is not limited to those examples.Multiple variations and modification to the disclosed embodiments willoccur, to the extent not mutually exclusive, to those skilled in the artupon consideration of the foregoing description. Such variations andmodification, however, fall well within the scope of the presentinvention as set forth in the following claims.

What is claimed is:
 1. A manufacture method of a semiconductor device,comprising: providing a substrate; forming first and second conductivelines over the substrate; forming a first plug coupled to the firstconductive line, and orthogonal to the first conductive line and thesubstrate; forming a second plug coupled to the second conductive line,and orthogonal to the second conductive line and the substrate; forminga first memory cell disposed on a first sidewall beside the first plug,the first sidewall being orthogonal to the substrate; and forming asecond memory cell disposed on a second sidewall beside the second plug,the second sidewall being orthogonal to the substrate, wherein the firstmemory cell is over the second memory cell.
 2. The manufacture method ofclaim 1, wherein the first and second conductive lines are arranged inrespective first and second levels above the substrate.
 3. Themanufacture method of claim 1, wherein the first and second conductivelines comprise material having a conductivity type opposite aconductivity type of material of the first and second plugs.
 4. Themanufacture method of claim 3, wherein the first and second conductivelines comprise polysilicon having a first conductivity type, and thefirst and second plugs comprise polysilicon having a second conductivitytype opposite the first conductivity type.
 5. The manufacture method ofclaim 1, wherein the second conductive line is directly above the firstconductive line.
 6. The manufacture method of claim 1, wherein the firstmemory cell and the second memory cell comprise non-volatile memorycells.
 7. The manufacture method of claim 1, wherein the first memorycell and the second memory cell comprise anti-fuse elements.
 8. Amanufacture method of a semiconductor device, comprising: forming afirst conductive line; forming a second conductive line orthogonal tothe first conductive line; forming a plug coupled to the firstconductive line, and orthogonal to the first and second conductivelines; forming a memory cell disposed on a sidewall beside the plug, andbetween the second conductive line and the plug; and wherein the secondconductive line comprises polysilicon having a first conductivity type,and the plug comprises polysilicon having a second conductivity typeopposite the first conductivity type.
 9. The manufacture method of claim8, wherein the second conductive line is above the first conductiveline.
 10. The manufacture method of claim 8, wherein the secondconductive line comprises material having a conductivity type opposite aconductivity type of material of the plug.
 11. The manufacture method ofclaim 8, wherein the memory cell comprises a non-volatile memory cell.12. The manufacture method of claim 8, wherein the memory cell comprisesan anti-fuse element.
 13. A method of fabricating an arrangement ofnonvolatile memory devices, the method comprising: (a) providing asemiconductor substrate; (b) forming an oxide layer; (c) forming aplurality of word lines above the oxide layer; (d) forming a pluralityof bit lines above the oxide layer; (e) etching a plurality of via holesformed between the plurality of word lines and the plurality of bitlines; (f) forming a memory material disposed beside the plurality ofbit lines and in electrical contact with the plurality of bit lines, thememory material forming a plurality of side wall memory elements besidethe bit lines; and (g) forming a plurality of via plugs in electricalcommunication with the plurality of word lines and in electricalcommunication with the plurality of side wall memory elements.
 14. Themethod of fabricating an arrangement of nonvolatile memory devicesaccording to claim 13, wherein the bit lines are formed from polysiliconhaving a first type of background impurity and the via plugs are formedfrom polysilicon having a second type of background impurity opposite tothe first type.
 15. The method of fabricating an arrangement ofnonvolatile memory devices according to claim 15, wherein the first typeof background impurity is N-type and the second type of backgroundimpurity is P-type.
 16. The method of fabricating an arrangement ofnonvolatile memory devices according to claim 15, wherein the first typeof background impurity is P-type and the second type of backgroundimpurity is N-type.
 17. The method of fabricating an arrangement ofnonvolatile memory devices according to claim 14, wherein the step offorming a plurality of word lines further comprises the step of forminga plurality of pairs of word lines.
 18. The method of fabricating anarrangement of nonvolatile memory devices according to claim 17, whereinthe pairs of word lines are disposed on different horizontal planes. 19.The method of fabricating an arrangement of nonvolatile memory devicesaccording to claim 18, wherein the bit lines are formed from polysiliconhaving a first type of background impurity and the via plugs are formedfrom polysilicon having a second type of background impurity opposite tothe first type.